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Potting Compounds & Coatings
HYSOL® Liquid Potting Compounds are one and two component electronic module encapsulants with low viscosity, low temperature cure. They provide low stress and shrinkage for increased productivity and performance. Dexter also produces formulated liquid systems to encapsulate and protect ignition coils and advanced sensors for the automotive industry.
Room Teperature Cure Epoxies
| System | Description | Typical Applications |
|
| Resin | Hardener | ||
| RE2038 | HYSOL® HD3404 |
A low viscosity, rigid casting system using a diluted base resin. EE4143 is the silica filled resin for improved thermal properties, lower shrinkage and lower coefficient of expansion. | General potting, solenoids, transformers (small), resistors, capacitors, modules |
| EE4143 | |||
| RE2039 | An undiluted, 100% solids, rigid casting for optimum physical and electrical properties and chemical resistance. EE4183 is the silica filled resin for improved thermal properties, lower shrinkage and lower coefficient of expansion. | ||
| EE4183 | |||
| RE2039 | HYSOL® HD3561 |
An undiluted, low viscosity casting system that exhibits exceptional resistance to impact and thermal shock. Filled resin EE4183 provides improved thermal properties, lower shrinkage and lower coefficient of expansion. This system adheres extremely well to most surfaces. | Capacitors, clear castings, coils, modules, solid state relays |
| EE4183 | |||
| RE2038 | HYSOL® HD3475 |
A medium viscosity diluted resin based system that offers easy mix ratio and reduced toxicity potential. Filled resin EE4143 provides improved thermal properties, lower shrinkage and lower coefficient of expansion. | General potting, higher viscosity than HD3404 |
| EE4143 | |||
| RE2039 | HYSOL® HD3719 |
An undiluted, semi-flexible casting compound with easy mixing ratio, long pot life and large mass casting capability. Flexibility may be increased by the addition of up to 50% more HD3719. EE4183 is the silica filled resin for improved thermal properties, lower shrinkage and lower coefficient expansion. | Resilient material for large castings, coils, modules, solid state relays |
| EE4183 | |||
| HYSOL® ES4212 | Extremely versatile black casting system with long pot life, low cost and low exotherm. Its 1-to-1 volume mix ratio and soft filler make it ideal for machine dispensing or hand mixing. ES4312 is a faster curing version of ES4212. ES4412 is a lower viscosity version of ES4312 for faster processing through dispensing equipment or easier flow in restricted packages. ES4512 is the UL 94 V-O version. | General potting, coils, modules, small transformers, capacitors | |
| HYSOL® ES4312 | |||
| HYSOL® ES4412 | |||
Heat Cure Epoxies
| System | Description | Typical Applications |
|
| Resin | Hardener | ||
| RE2039 | HYSOL® HD0242 |
An undiluted casting system for moderate elevated temperature applications. Filled resin EE4183 provides improved thermal properties, lower shrinkage and lower coefficient of expansion. | Medium Tg (120 ° C) material for potting coils and resistors |
| EE4183 | |||
| HYSOL® EE4183 |
HYSOL® HD3485 |
A filled, extremely low exotherm system for very large castings. It has excellent electrical insulation properties and performs well as an encapsulant for high voltage power supplies and bushings. | Very large castings, to 400 lbs., electrical bushings |
| RE2039 | HYSOL® HD0243 |
A high heat distortion, humidity resistant casting compound which has excellent chemical resistance and electrical properties. EE4183 is the silica filled resin for improved thermal properties, lower shrinkage and lower coefficient of expansion. | High Tg (132 ° C) material for potting coils and resistors |
| EE4183 | |||
| HYSOL® EE4183 |
HYSOL® HD3537 |
A filled, anhyride cured sysem with an extremely high heat deflection temperature. The cured system displays excellent electrical properties through a broad range of frequencies and temperatures up to 200 ° C (392 ° F) | Potting transformers and other parts where high temperatures are expected |
One Component Epoxies
| System | Description | Typical Applications |
|
| Resin | Hardener | ||
| HYSOL® EO0104 |
A one-component casting compound that offers thermal shock resistance and flameout properties. It is an extremely stable system at room temperature and offers the handling advantages of a one-component. EO0104 should not be used for casting masses larger than 50 grams. | Potting small modules, connectors and sensors | |
| HYSOL® EO0202 |
A one-component, non-abrasive filled epoxy encapsulant featuring excellent shelf life, thermal shock and chemical resistance. EO0202 should not be used for casting masses larger than 50 grams. | Sealing filter endcaps, general potting | |
Urethanes
| System | Description | Pot Life | Viscosity Centipose |
Cure |
| HYSOL® US0028 |
A low toxicity, low viscosity, room temperature curing urethane casting system for general purpose use which cures to a hardness of Shore A60. Useful up to 125 ° C (257 ° F). | 90-105 minutes |
4,000-5,000 | 24 hrs. @ RT or 4 hrs. @ 85 ° C |
| HYSOL® US0044 |
Clear, low viscosity urethane casting system featuring optical clarity and ultra-violet resistance. Shore A90 hardness. Used for decorative doming | 4 minutes | 5,000 | 8 hrs. @ RT |
| HYSOL® US0096 |
This is a specially formulated urethane to meet the flammability requirements of UL94 V-O (non-drip). It cures to a hardness of Shore D55. | 40 minutes | 2,500 | 4 hrs. @ 85 ° C |
PC Coatings
| System | Description | Military Version |
Pot Life |
Cure | Film Thickness |
| HYSOL® PC12-007 |
A 100% solids epoxy, printed circuit coating for dip or brush application. It may be thinned with toluene for spray application. | PC12-007M | 190 minutes |
2 hrs. @ 75 ° C or 4 hrs. @ 65 ° C |
5-7 mils |
| HYSOL® PC18 |
A clear one-component urethane printed circuit coating for brush, dip or spray application. This tough abrasion resistant coating provides excellent environmental protection. | PC18M | n/a | 2 hrs. @ 60 ° C or 5-7 days @ RT |
1-2 mils |
| HYSOL® PC20 |
A one-component acrylic printed circuit coating with excellent clarity up to 110 ° C. May be repaired with soldering iron or coating and can be removed with suitable solvent. | PC20M | n/a | 45 min. @ 75 ° C or 24 hrs. @ RT | 1-2 mils |
Specialty Products
| System | Description | Mix Ratio by Weight |
Viscosity Centipose |
Cure | |
| HYSOL® ES0495 |
A two-component epoxy casting system featuring high thermal conductivity with medium viscosity. | 100/7 | 10,000 | 24 hrs. @ 25° C or 2 hrs. @ 60 ° C | |
| HYSOL® ES0397 |
A two-component epoxy casting system especially recommended for large castings (e.g. transformers). | 100/95 | 57,000 cps @ 25 ° C 7,000 cps @ 50 ° C |
3 hrs. @ 80° C | |
| HYSOL® EE1068 (EE1067) |
HYSOL® HD3561 |
A black flame-out casting system which meets the UL flammability requirements for 94V-O. EE1067 is the unpigmented version of EE1068. | 100/15 | 1,000 | 3 hrs. @ 60° C or 24 hrs. @ RT |
| HYSOL® EE1068 (EE1067) |
HYSOL® HD0243 |
A black flame-retardant system designed for applications requiring higher service temperatures. | 100/13 | 20,000 | 6-8 hrs. @ 125° C |
| HYSOL® EE1087 | HYSOL® HD3404 |
High thermally conductive black casting systems for applications requiring heat dissipation or transfer. Hardener HD0243 should be used for higher temperature applications. | 100/3 | 30,000 | 2 hrs. @ 60° C or 24 hrs. @ RT |
| HYSOL® HD3561 |
100/7 | 8,000 | 2 hrs. @ 60° C or 24 hrs. @ RT | ||
| HYSOL® HD0243 |
100/6 | 30,000 | 6-8 hrs. @ 125° C | ||
Enviro-Clean
Cleaner and Adhesive remover for industry
Basic Purpos & Description : Enviro-Clean is the complete replacement for solvents, acetones, tolulene, and other common but dangerous cleaners found in the industry today. With the use of our technology, Enviro Clean will replace current hazardous chemicals effectively while addressing employee safety and environmental compliance issues.
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Current Applications and Industries using Enviro-Clean
- Electronic Manufacturing
- Shoe Manufacturers
- Boat Manufacturers
- Window & Door Manufacturers
- Heavy Equipment Companies
- Adhesive Spills - for Concrete and Tables
- Adhesive Remover
- Plastics Industry
- Truck / Trailer / RV
- Rubber Industry
- Aerospace
- Parets & Tool Washing
- Automotive Industry
Dexter HYSOL® Electronic Formulated Liquid Products
Hysol® Electronic Formulated Liquids include room temperature cure epoxies, thermal cure epoxies, one component epoxies, urethanes, printed circuit board coatings, electrically conductive epoxies and other specialty products.
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| Room Temperature Cure Epoxies Thermal Cure Epoxies One Component Epoxies Urethane Systems Printed Circuit Board Coatings Specialty Products Electrically Conductive Epoxies |
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